Kondo Kazuo et al. (eds.) Copper Electrodeposition for Nanofabrication of Electronics Devices

Kondo, K., Akolkar, R.N., Barkey, D.P., Yokoi, M. (Eds.) — Springer New York, 2014. — 290 p. — ISBN: 978-1-4614-9176-7.This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:
ULSI wiring material based upon copper nanowiring
Printed circuit boards
Stacked semiconductors
Through Silicon Via
Smooth copper foil for Lithium-Ion battery electrodesCopper Electrodepositon and Additive Chemistry
Copper Electrodepositon
Supression Effect and Additive Chemistry
Acceleration Effect
Modeling and Simulation
Copper on Chip Metallization
Frontiers of Cu Electrodeposition and Electroless Plating
Microstructure Evolution of Copper in Nanoscale
Direct Copper Plating
Through Silicon Via and Other Methods
Through Silicon Via
Build-up Printed Wiring Boards (Build-up PWBs)
Copper Foil Smooth on Both Sides for Lithium-Ion Battery
Through Hole Plating