Subramanian K.N. (Ed.) Lead-Free Solders: Materials Reliability for Electronics

John Wiley and Sons Ltd, UK, 2012. — 497 p. — ISBN: 0470971827Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:
Phase diagrams and alloy development
Effect of minor alloying additions
Composite approaches including nanoscale reinforcements
Mechanical issues affecting reliability
Reliability under impact loading
Thermomechanical fatigue
Chemical issues affecting reliability
Whisker growth
Electromigration
Thermomigration
Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters
Phase Diagrams and Their Applications in Pb-Free Soldering
Phase Diagrams and Alloy Development
Interaction of Sn-based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry
Microalloying to Improve Reliability
‘Effects of Minor Alloying Additions on the Properties and Reliability of Pb-Free Solders and Joints’
Development and Characterization of Nano-composite Solder
Chemical Issues Affecting Reliability
Chemical Changes for Lead-Free Soldering and Their Effect on Reliability
Influence of Microstructure on Creep and High Strain Rate Fracture of Sn-Ag-Based Solder Joints
Microstructure and Thermomechanical Behavior Pb-Free Solders
Electromechanical Coupling in Sn-Rich Solder Interconnects
Effect of Temperature-Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn-Ag Solder Joints
Whisker Growth Issues Affecting Reliability
Sn Whiskers: Causes, Mechanisms and Mitigation Strategies
Tin Whiskers
Electromigration Issues Affecting Reliability
Electromigration Reliability of Pb-Free Solder Joints
Electromigration in Pb-Free Solder Joints in Electronic Packaging
Effects of Electromigration on Electronic Solder Joints
Thermomigration Issues Affecting Reliability
Thermomigration in SnPb and Pb-Free Flip-Chip Solder Joints
Miniaturization Issues Affecting Reliability
Influence of Miniaturization on Mechanical Reliability of Lead-Free Solder Interconnects